发明名称 STRUCTURE OF BATTERY PROTECTION CIRCUIT MODULE PACKAGE COUPLED WITH HOLDER, AND BATTERY PACK HAVING SAME
摘要 The present invention relates to a battery pack with improved bonding strength capable of simplifying processes, and a method for manufacturing the same. Provided is a battery pack comprising: a bonding structure including a basic package, an encapsulant and a holder, the basic package having a lead frame consisting of a plurality of leads spaced apart from each other, and a protection circuit component on the lead frame, wherein the encapsulant and the holder are simultaneously formed through an insert injection molding by disposing the basic package within a first injection mold and injecting a resin melt; a battery core pack coupled with the bonding structure; and an upper case for encasing the upper part of the battery core pack, in which the bonding structure is embedded. In the bonding structure, the encapsulant encapsulates the protection circuit component while exposing a part of the lead frame, the encapsulant and the basic package constitute the battery protection circuit module package, and the holder is coupled with the battery protection circuit module package by the insert injection molding.
申请公布号 WO2015009087(A1) 申请公布日期 2015.01.22
申请号 WO2014KR06517 申请日期 2014.07.18
申请人 ITM SEMICONDUCTOR CO.,LTD 发明人 NA, HYEOKHWI;HWANG, HOSEOK;BACH, JONGUN;KANG, HYANGWON;PARK, SEUNGYONG;SONG, SUNGHO;JUNG, DAWOON
分类号 H01M2/34;H01M2/02;H01M2/30 主分类号 H01M2/34
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