| 摘要 |
A light emitting diode package having electrical stability against thermal stress according to an embodiment includes a body having a cavity; a light emitting device which is arranged in a cavity and includes a first semiconductor layer, a second semiconductor layer, and an active layer located between the first semiconductor layer and the second semiconductor layer; a lead frame which is located in a region of the body, is connected to the light emitting device, and has a recess part in a region of an upper surface; and a wire which has one end arranged in the recess part to be connected to the lead frame and has the other end connected to the light emitting device; and a protection layer which is arranged to surround an end of the wire adjacent to the recess part. |
