| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a thermosetting composition which enables a cured film with excellent flatness is to be formed while maintaining heat resistance possessed by a cured product of a polyesteramide acid-based thermosetting composition, and to provide a thermosetting composition with excellent low-temperature curability. <P>SOLUTION: A reaction product (A) is obtained by making a dicarboxylic acid anhydride (a1), an amino compound (a2) represented by general formula (1), a hydrolyzable silicon compound (a3) other than the amino compound (a2), and a metal alkoxide (a4) react with one another. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
