发明名称 MOLDED FLUID FLOW STRUCTURE
摘要 In an example, a fluid ejection apparatus includes a printhead die embedded in a printed circuit board. Fluid may flow o the printhead die through a plunge-cut fluid feed slot in the printed circuit board and into the printhead die.
申请公布号 EP2825386(A1) 申请公布日期 2015.01.21
申请号 EP20130876566 申请日期 2013.02.28
申请人 HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. 发明人 CHEN, CHIEN-HUA;CUMBIE, MICHAEL W.
分类号 B41J2/14;B41J2/045;B41J2/16 主分类号 B41J2/14
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