| 摘要 |
Embodiments of the present invention provide an immersion cooling system, including: an electronic device, a non-conductive working medium, and one or more gasbags. The electronic device is immersed in the non-conductive working medium; the non-conductive working medium is configured to dissipate heat for the electronic device, and a volume of the non-conductive working medium expands as a temperature rises; and a surface of the gasbag is elastic, and the gasbag is configured to reduce its volume when the gasbag is compressed by volume expansion of the non-conductive working medium, so as to buffer a pressure rise in the system, where the pressure rise is caused by the volume expansion of the non-conductive working medium. With the immersion cooling system provided in the embodiments of the present invention, a gasbag is used in place of an exhaust valve, so that installation is more flexible and cooling performance of the system is further improved. |
