熱硬化性樹脂組成物およびプリント配線板用層間接着フィルム

摘要

PROBLEM TO BE SOLVED: To provide a thermosetting resin composition by which a cured product excellent in dimensional stability can be obtained and furthermore an insulating layer excellent in low-temperature melting properties can be obtained; and to provide an interlayer adhesive film for obtaining the insulating layer.SOLUTION: The thermosetting resin composition comprises a polyimide resin (A) having a biphenyl backbone content of 20-45 mass% and logarithmic viscosity of 0.2-0.8 dl/g and an epoxy resin (B). The interlayer adhesive film for printed wiring board can be obtained by applying the thermosetting resin composition on a carrier film and drying it.