| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a jig plate which can easily stack a plurality of semiconductor device chips corresponding to each of semiconductor devices formed on a semiconductor device wafer. <P>SOLUTION: In the jig plate which is used when a semiconductor device chip having a second semiconductor device formed thereon is stacked on each of first semiconductor devices of a semiconductor device wafer having the first semiconductor devices formed in each of regions that are partitioned by a plurality of crossing predetermined division lines, the jig plate has a reference pattern corresponding to the predetermined division lines of the semiconductor device wafer formed thereon. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
