发明名称 |
PRECIPITATION METHOD FOR CONDUCTIVE POLYMER-METAL COMPLEX, AND CONDUCTIVE POLYMER-METAL COMPLEX |
摘要 |
<p>The invention has for its object to provide a process of producing a conducting material suitable for being filled in TSVs for LSI chip 3D package, etc. A solution containing a monomer that provides a conducting polymer, anions, and metal ions such as Ag + or Cu 2+ is irradiated with ultraviolet radiation or light having the energy necessary for exciting electrons up to an energy level capable of reducing the metal ions to precipitate a conducting polymer/metal composite. This enables an electrical conductor of high electrical conductivity to be precipitated faster than could be achieved by conventional processes.</p> |
申请公布号 |
EP2740751(A4) |
申请公布日期 |
2015.01.21 |
申请号 |
EP20120820585 |
申请日期 |
2012.07.27 |
申请人 |
NATIONAL INSTITUTE FOR MATERIALS SCIENCE |
发明人 |
KAWAKITA JIN;CHIKYO TOYOHIRO |
分类号 |
C08G61/12;C08G73/00;C08G73/02;C08K3/00;C08K3/08;C08L65/00;H01B1/02;H01B1/12;H01B13/00;H01L51/00;H01L51/30;H05K1/09;H05K3/10 |
主分类号 |
C08G61/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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