发明名称 HEAT DISSIPATION STRUCTURE OF HEAT SPREADING DEVICE WITH HIGH HEAT DISSIPATING FUNCTION
摘要 <p>The present invention relates to a heat dissipation structure of a heat spreading device with a high heat dissipating function to improve heat dissipating performance by absorbing heat generated in a heating component and spreading it to a wide area, through a heat dissipation structure which is made of a phase change material which is filled in the pore space of a porous structure. A heat dissipation structure of a heat spreading device with a high heat dissipating function according to the present invention comprises a porous structure which conducts heat; and a phase change material which is filled in the pore space of the porous structure.</p>
申请公布号 KR20150007827(A) 申请公布日期 2015.01.21
申请号 KR20130082361 申请日期 2013.07.12
申请人 LG ELECTRONICS INC. 发明人 LEE, JIN SEOK;YEE, YOUNG JOO
分类号 H05K7/20 主分类号 H05K7/20
代理机构 代理人
主权项
地址