发明名称 |
HEAT DISSIPATION STRUCTURE OF HEAT SPREADING DEVICE WITH HIGH HEAT DISSIPATING FUNCTION |
摘要 |
<p>The present invention relates to a heat dissipation structure of a heat spreading device with a high heat dissipating function to improve heat dissipating performance by absorbing heat generated in a heating component and spreading it to a wide area, through a heat dissipation structure which is made of a phase change material which is filled in the pore space of a porous structure. A heat dissipation structure of a heat spreading device with a high heat dissipating function according to the present invention comprises a porous structure which conducts heat; and a phase change material which is filled in the pore space of the porous structure.</p> |
申请公布号 |
KR20150007827(A) |
申请公布日期 |
2015.01.21 |
申请号 |
KR20130082361 |
申请日期 |
2013.07.12 |
申请人 |
LG ELECTRONICS INC. |
发明人 |
LEE, JIN SEOK;YEE, YOUNG JOO |
分类号 |
H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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