发明名称 MULTILAYER WIRING BOARD
摘要 <p>A multilayer wiring board has a strip structure comprising a core material in which a ground pattern is disposed on one side of an insulating layer and a strip line is disposed on the other side, a prepreg disposed on the strip line of the core material, and a ground pattern disposed on the prepreg. In this multilayer wiring board, the core material is formed with a high frequency-adaptive base material, and the prepreg is formed with a general-purpose material.</p>
申请公布号 KR20150008090(A) 申请公布日期 2015.01.21
申请号 KR20147031223 申请日期 2013.05.09
申请人 HITACHI CHEMICAL COMPANY, LTD. 发明人 KATOU MASAHIRO;KOSHIKAWA YASUYUKI;WADA HIROSHI
分类号 H05K3/46;H05K1/02 主分类号 H05K3/46
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