| 摘要 |
PURPOSE:To readily carry out surface treatment at a low cost and remarkably improve adhesion by dipping a specific polyimide resin composition in a treating solution of a specific composition. CONSTITUTION:A polyimide resin composition containing a polyimide resin having recurring units expressed by the formula is dipped in a treating solution composed of 1.5-9.0 pts.wt. alcohol such as methanol, ethanol, propanol, butanol, pentanol and/or hexanol, 0.3-1.5 pts.wt. inorganic base such as sodium hydroxide, potassium hydroxide, lithium hydroxide, magnesium hydroxide, calcium hydroxide and/or barium hydroxide and 0.05-1.0 pt.wt. organic base such as hydrazine hydrate, ethylenediamine, propylenediamine and/or hexamethylenediamine based on 1 pt.wt. water. Thereby, surface treatment is readily carried out. |
