| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an easy and efficient manufacturing method of an LED element equipped with connection electrodes with a mother board on an LED die bottom face, in which it is favorable that the connection electrodes protrude for relaxing implementation limits against dust and burrs. <P>SOLUTION: A semiconductor light-emitting element manufacturing method comprises: preparing LED dies 16 each equipped with bump electrodes 12, 13 and a pressure sensitive sheet 31; arranging the LED dies on the pressure sensitive sheet 31 with burying the bump electrodes 12, 13 such that a bottom face of the LED die 16 contacts a pressure sensitive layer 31a of the pressure sensitive sheet 31; and cutting a phosphor layer 11 after covering the LED dies 16 and the pressure sensitive sheet 31 with the phosphor layer to obtain singulated LED dies 10. <P>COPYRIGHT: (C)2013,JPO&INPIT |
