| 摘要 |
Cu-Co-Si-based alloy strip, which has not only an excellent balance between strength and electrical conductivity but also suppressed hanging curl, is provided. The copper alloy strip for electronic materials comprises 0.5-2.5 mass% of Co, 0.1-0.7 mass% of Si, the balance Cu and inevitable impurities, wherein, from a result obtained from measurement of an X ray diffraction pole figure, using a rolled surface as a reference plane, the following (a) is satisfied.
(a) A diffraction peak height at ß angle 120° among diffraction peak intensities by ß scanning at ±=25° in a {200} pole figure is at least 10 times that of standard copper powder. |
