Semiconductor package, method and mold for producing same, input and output terminals of semiconductor package

摘要

A semiconductor package according to the present invention includes: a semiconductor element where a high frequency signal is input or output; a planar lead terminal having an end electrically connected to an input terminal or an output terminal of the semiconductor element; an encapsulation resin for encapsulating the lead terminal and the semiconductor element, the lead terminal having another end exposed from the resin; and a ground enhancing metal body encapsulated in the encapsulation resin, having a first main surface facing the lead terminal and a second main surface exposed from the encapsulation resin, wherein the ground enhancing metal body has a shape with a cross section parallel to the second main surface and having a smaller area than an area of the first main surface.

主权项

1. A semiconductor package comprising:
a semiconductor element where a high frequency signal is input and/or output; a planar lead for transmitting the high frequency signal to the semiconductor element or an external circuit, the lead having an end electrically connected to an input terminal or an output terminal of the semiconductor element; a resin for encapsulating the lead and the semiconductor element, the lead having another end exposed from the resin; and an electric conductor for ground enhancement having a first main surface and a second main surface opposite to the first main surface, and encapsulated in the resin, the first main surface facing the lead with the resin therebetween, the second main surface being exposed from the resin, wherein the electric conductor has a shape with a cross section parallel to the second main surface and having a smaller area than an area of the first main surface.