| 发明名称 | Integrated circuit package system with molded strip protrusion | ||
| 摘要 | An integrated circuit package system includes an in-line strip, attaching an integrated circuit die over the in-line strip, and applying a molding material with a molded segment having a molded strip protrusion formed therefrom over the in-line strip. | ||
| 申请公布号 | US8937372(B2) | 申请公布日期 | 2015.01.20 |
| 申请号 | US200711689317 | 申请日期 | 2007.03.21 |
| 申请人 | STATS ChipPAC Ltd. | 发明人 | Yee Jae Hak;Myung Junwoo |
| 分类号 | H01L21/02;H01L23/28;H01L21/56;H01L23/31;H01L23/00 | 主分类号 | H01L21/02 |
| 代理机构 | Ishimaru & Associates LLP | 代理人 | Ishimaru & Associates LLP |
| 主权项 | 1. A method for manufacturing an integrated circuit package system comprising: providing an in-line strip; attaching an integrated circuit die over the in-line strip; and applying a molding material to form a molded strip over the in-line strip, wherein the molded strip includes a molded segment over the integrated circuit die, a molded strip bridge between the molded segment, and a molded strip protrusion surrounding the molded segment along an edge of the in-line strip. | ||
| 地址 | Singapore SG | ||