POLYPROPYLENE RESINE COMPOSITION FOR HEAT SEAL AND MULTI-LAYER FILM USING THE SAME

摘要

The present invention relates to a polypropylene resin composition for heat bonding with excellent heat bonding, transparency and a high crystallization temperature. More specifically, a polypropylene resin composition for heat bonding comprises (A) 100 parts by weight of crystalline ethylene-propylene-1-butene terpolymer whose melting point is between 125 and 135 degree Celsius; (B) 1-10 parts by weight of ethylene alpha-olefins copolymer whose density is 0.85-0.92 g/cm^3 and which is manufactured by a single-site catalyst; (C) and 0.1-0.5 parts by weight of an organic nucleating agent.