MEMORY MODULE IMPROVING DATA SIGNAL INTEGRITY

摘要

A memory module to improve data signal fidelity is disclosed. The memory module includes memory chips arranged on a printed circuit board; data buffers disposed on a first surface of the printed circuit board, and connected to the memory chips to correspond thereto, and resistance units disposed on a second surface opposite to the first surface of the printed circuit board, and connected to the data buffers to correspond thereto, wherein the resistance unit has a first terminal connected to a connecting terminal of the printed circuit board, and a second terminal connected to an input terminal of the data buffer through a first via hole passing through the printed circuit board, wherein an output terminal of the data buffer is connected to the memory chip through a signal line formed on an internal layer of the printed circuit board through a second via hole, and wherein the input terminal of the data buffer is disposed adjacent to the memory chip, and the output terminal of the data buffer is disposed adjacent to the connecting terminal.