| 发明名称 | Integrated circuit package system with device cavity | ||
| 摘要 | An integrated circuit package system is provided including connecting an integrated circuit die with an external interconnect, forming a first encapsulation having a device cavity with the integrated circuit die therein, mounting a device in the device cavity over the integrated circuit die, and forming a cover over the device and the first encapsulation. | ||
| 申请公布号 | US8937393(B2) | 申请公布日期 | 2015.01.20 |
| 申请号 | US200711744062 | 申请日期 | 2007.05.03 |
| 申请人 | STATS ChipPAC Ltd. | 发明人 | Bathan Henry Descalzo;Camacho Zigmund Ramirez;Tay Lionel Chien Hui;Dahilig Frederick Rodriguez |
| 分类号 | H01L21/683;H01L21/56;H01L23/31;H01L23/495;H01L23/00 | 主分类号 | H01L21/683 |
| 代理机构 | Ishimaru & Associates LLP | 代理人 | Ishimaru & Associates LLP |
| 主权项 | 1. A method of manufacturing an integrated circuit package system comprising: connecting an integrated circuit die, having a non-active side, with an external interconnect; forming a first encapsulation having a device cavity with the integrated circuit die in the device cavity exposing the non-active side; mounting a device in the device cavity over the integrated circuit die; and forming a cover over the device and having a non-horizontal cover side facing a non-horizontal encapsulation side of the first encapsulation. | ||
| 地址 | Singapore SG | ||