Semiconductor packages with heat dissipation structures and related methods

摘要

Semiconductor packages including a die pad, at least one connecting bar, at least one supporting portion, a plurality of leads, a semiconductor chip, a heat sink and a molding compound. The connecting bar connects the die pad and the supporting portion. The leads are electrically isolated from each other and the die pad. The semiconductor chip is disposed on the die pad and electrically connected to the leads. The heat sink is supported by the supporting portion. The molding compound encapsulates the semiconductor chip and the heat sink. Heat from the semiconductor chip is efficiently dissipated from the die pad through the connecting bar, through the supporting portion, and through the heat sink.

主权项

1. A semiconductor package, comprising:
a die pad; at least one connecting bar extending outwardly from the die pad; at least one supporting portion extending from the at least one connecting bar at a location spaced from the die pad and including an upper surface that is elevated above an upper surface of the die pad; a plurality of leads disposed around the die pad, and being electrically isolated from each other and the die pad; a semiconductor chip disposed on the die pad and electrically connected to the leads; a heat sink attached to the upper surface of the at least one supporting portion; and a molding compound encapsulating the semiconductor chip, at least portions of the heat sink, at least portions of the die pad, at least portions of the connecting bar, at least portions of the supporting portion, and at least portions of each of the leads; wherein the die pad, the connecting bar, and the supporting portion are made of metal.