发明名称 METHOD AND APPARATUS FOR APPLYING FLUX
摘要 <p>A dispensing apparatus for applying a thin stream of flux to a surface (14) of a printed circuit board (10). The dispensing head (42) travels (70) at a high rate of speed relative to the board (10) during the dispensing, preferably at a rate of approximately 20 to 90 inches per second. Tips that dispense the flux are angularly disposed relative to the board (10) and can make multiple passes over selected regions. Either the board (10) is incrementally advanced through the flux station (C) or the dispensing head (42) is incrementally advanced relative to the board (10). The dispensing head (42) can be disposed above, but preferably below board (10). An absorbent material (110) located above the board (10) collects bypass flux. All electrical components (46, 62, 72, 74, 86) are located outside of work chamber (66) to limit adverse reaction with fluxes.</p>
申请公布号 WO1994004305(A1) 申请公布日期 1994.03.03
申请号 US1993007741 申请日期 1993.08.17
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