发明名称 POLYAMIDE MOULDING MATERIAL AND USE THEREOF FOR PRODUCTION OF LED HOUSING COMPONENTS
摘要 <p>Polyamide molding material based on semicrystalline polyamides, comprises (a) 40-80 wt.% of at least a semiaromatic polyamide based on at least 70 mol.% of aromatic dicarboxylic acids and at least 70 mol.% of 4-18C aliphatic diamines having a melting temperature of 270-340[deg] C, (b) 10-30 wt.% of titanium dioxide particles, (c) 5-20 wt.% of glass fibers, (d) 5-30 wt.% of calcium carbonate and optionally (e) customary additives (E), where the sum of quantity of (b), (c) and (d) is 20-60 wt.%, the weight ratio of (c)/(d) is 0.25-1.5.</p>
申请公布号 KR101484595(B1) 申请公布日期 2015.01.20
申请号 KR20110045699 申请日期 2011.05.16
申请人 发明人
分类号 C08K3/22;C08K3/26;C08K7/14;C08L77/06 主分类号 C08K3/22
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