Superconductive multi-chip module for high speed digital circuits

摘要

A method for electrically interconnecting two substrates, each having a corresponding set of preformed electrical contacts, the substrates comprising an electronic circuit, and the resulting module, is provided. A liquid curable adhesive is provided over the set of contacts of a first substrate, and the set of electrical contacts of the second substrate is aligned with the set of electrical contacts of the first substrate. The sets of electrical contacts of the first and second substrate are compressed to displace the liquid curable adhesive from the inter-contact region, and provide electrical communication between the respective sets of electrical contacts. The liquid curable adhesive is then cured to form a solid matrix which maintains a relative compression between the respective sets of electrical contacts. One embodiment of the module comprises a high-speed superconducting circuit which operates at cryogenic temperatures.

主权项

1. A module having electrical interconnections along predefined paths between at least two substrates, at least one of the substrates comprising a functional superconducting electronic device, comprising:
first and second substrates, each having corresponding sets of predefined electrical contacts; and a cured adhesive surrounding the sets of predefined electrical contacts, wherein the corresponding sets of predefined electrical contacts are not thermally welded together, said cured adhesive comprising a stable solid matrix adhering to the first and second substrates and being configured to maintain mutual compression and electrical conductivity between the corresponding sets of predefined electrical contacts over the entire temperature range from +50 C to −175 C.