发明名称 Polishing and electroless nickel compositions, kits, and methods
摘要 Disclosed are various methods, kits, and compositions in the field of electroless nickel plating and chemical polishing. An electroless nickel plating composition may include a surfactant-brightener; a coupler; a bismuth metallic stabilizer; and organosulfur stabilizer and a bismuth complexer. Prior to plating, a substrate may be polished with a polishing composition that includes a surface blocker and a surface leveler. When practiced in accordance with the preferred teachings described herein, the electroless nickel plating composition is capable of providing a mirror-bright, lustrous finish, and has good leveling properties. The composition may be made without lead or cadmium.
申请公布号 US8936672(B1) 申请公布日期 2015.01.20
申请号 US201313904510 申请日期 2013.05.29
申请人 Accu-Labs, Inc. 发明人 Tremmel Peter;Broch Orville;Cornwell Stephen Brent
分类号 C23C18/36;C23C18/18;C09K13/00;C09K13/08;B65D81/32 主分类号 C23C18/36
代理机构 Fitch, Even, Tabin & Flannery LLP 代理人 Fitch, Even, Tabin & Flannery LLP
主权项 1. A kit comprising: a first container containing a first composition and a second container containing a second composition, said first composition containing nickel and said second composition containing a reducing agent, said first and second compositions being combinable to form an electroless nickel plating composition; said first composition containing a surfactant-brightener, said surfactant-brightener being present in an amount effective to enhance luster of an object plated with said electroless nickel plating composition, and a coupler, said coupler being present in an amount effective to inhibit oil-out of said surfactant-brightener; said second composition containing a bismuth metallic stabilizer in an amount effective to inhibit plate-out of said electroless nickel plating composition, and a bismuth complexer, said bismuth complexer being present in an amount effective to inhibit precipitation of bismuth.
地址 Chicago IL US