Multi-channel optical receiver module

摘要

A multi-channel optical receiver module, includes a light-receiving element array, the light-receiving element array including multiple light-receiving elements; an amplifier disposed adjacent the light-receiving element array, the amplifier amplifying an output of a light-receiving element; a wiring relay submount disposed adjacent the amplifier; two wires for carrying a differential signal and being wired in parallel to one another and being connected between the wiring relay submount and the amplifier; an output pin; and another wire, the another wire being connected between the output pin and the wiring relay submount.

主权项

1. A multi-channel optical receiver module, comprising:
a light-receiving element array, the light-receiving element array including multiple light-receiving elements; multiple sets of components assigned to the light-receiving elements, respectively; each of the sets comprising:
an amplifier disposed adjacent to the light-receiving element array, the amplifier amplifying an output of a light-receiving element assigned thereto, the amplifier comprising two pads for bonding;a wiring relay submount disposed adjacent to the amplifier;two first wires for carrying a differential signal to be connected to the two pads of the amplifier by wire bonding and being disposed geometrically parallel to one another and being connected between the wiring relay submount and the amplifier;a first output pin and a second output pin;a second wire connecting between the amplifier and the light receiving element;a first another wire connecting between the wiring relay submount and the first output pin; and a second another wire connecting between the wiring relay submount and the second output pin; and a substrate configured to support the light-receiving element array and the multiple sets of components on a planar surface thereof, wherein the two first wires and the second wire are straight respectively and disposed nonparallel to each other when viewed in a plan view with respect to the planar surface of the substrate, wherein the wiring relay submount is disposed on a first virtual straight line connected between the first output pin and the second output pin, wherein the first output pin and the second output pin are located such that second and third virtual straight lines connected between the two pads and the first output pin and the second output pin, respectively, are located nonparallel, wherein the first and second another wires are two straight wires that connect the wiring relay submount to the first output pin and the second output pin without conducting wire bonding on the second and third virtual straight lines connected between the two pads and the first output pin and the second output pin, wherein the amplifier is not located on the first virtual straight line.