Process and device for producing at least one photonic component

摘要

A process for producing at least one photonic component (32, 33, 35, 39, 41), includes inserting the photonic component (32, 33, 35, 39, 41) into a surface layer (12) of a semiconductor wafer and/or within a semiconductor wafer, especially of a semiconductor chip (11, 31, 34, 38, 40) for the simpler and more cost-effective production with the most desired possible three-dimensional structures. At least one laser beam (22) is coupled into the material of the surface layer (12) and/or of the semiconductor wafer, in which the laser beam (22) is focused at a predetermined depth in the material. At least one property of the material and/or the material structure is changed in the area of focus (23, 36).

主权项

1. A process for producing at least one photonic component in a surface layer of a semiconductor wafer or semiconductor chip and/or within the semiconductor wafer or semiconductor chip, the process comprising the steps of:
coupling at least one laser beam into material of the surface layer and/or material layer of the semiconductor wafer or the semiconductor chip; focusing the laser beam at a predetermined depth in the material; changing at least one property of the material and/or a material structure of the material in an area of the focus, wherein in the area of focus a material hole is produced and/or a grid structure of the material is changed and crystalline silicon or monocrystalline silicon in the area of focus is converted into amorphous silicon and/or into a mixed phase between crystalline and amorphous silicon; inserting a photonic component into the material below and/or above a circuit layer of the semiconductor wafer or semiconductor chip, said circuit layer comprising one of a completely produced integrated circuit and a partially produced integrated circuit; and using an image recognition means for recognizing circuits of the circuit layer.