发明名称 |
Secondary device integration into coreless microelectronic device packages |
摘要 |
The present disclosure relates to the field of fabricating microelectronic device packages and, more particularly, to microelectronic device packages having bumpless build-up layer (BBUL) designs, wherein at least one secondary device is disposed within the thickness (i.e. the z-direction or z-height) of the microelectronic device of the microelectronic device package. |
申请公布号 |
US8937382(B2) |
申请公布日期 |
2015.01.20 |
申请号 |
US201113169162 |
申请日期 |
2011.06.27 |
申请人 |
Intel Corporation |
发明人 |
Teh Weng Hong;Guzek John S. |
分类号 |
H01L23/495;H01L23/31;H01L21/56;H01L23/00 |
主分类号 |
H01L23/495 |
代理机构 |
Winkle, PLLC |
代理人 |
Winkle, PLLC |
主权项 |
1. A microelectronic device package comprising:
a microelectronic device having an active surface and an opposing back surface, wherein a thickness of the microelectronic device is defined by the distance between the microelectronic device active surface and the microelectronic device back surface; at least one secondary device electrically connected to the microelectronic device, wherein the at least one secondary device is positioned proximate the microelectronic device within the thickness of the microelectronic device; and a dielectric layer disposed over the microelectronic device active surface and the at least one secondary device; wherein the dielectric layer abuts a portion of the microelectronic device between the microelectronic device active surface and the microelectronic back surface, and wherein the microelectron back surface and a portion of the microelectronic device between the microelectronic device active surface and the microelectronic back surface is exposed through the dielectric layer. |
地址 |
Santa Clara CA US |