Method for manufacturing wiring board for mounting electronic component, wiring board for mounting electronic component, and method for manufacturing wiring board having an electronic component

摘要

A method for manufacturing a wiring board for mounting an electronic component, a wiring board for mounting an electronic component, and a method for manufacturing an electronic-component-mounted wiring board are provided. A bonding material paste, which can include solder and an electric insulation material made of a resin, can be placed on chip mount terminal pads and heated to fuse the solder and soften the electric insulation material. Subsequently, the solder is solidified to form solder bumps. Further, the electric insulation material is cured on a surface of each of the solder bumps and a surface of a multilayer board around each of the solder bumps to form an electric insulation surface layer. Accordingly, when a chip is mounted to such wiring boards, the electric insulation surface layer minimizes or eliminates the connection between adjacent solder bumps during re-fusing of the solder.

主权项

1. A method for manufacturing a wiring board for mounting an electronic component by means of solder bumps formed on respective terminal pads of a multilayer board, which includes a conductor layer and a resin insulation layer layered one on top of the other, the method comprising:
putting on each of the terminal pads a bonding material that includes solder and an electric insulation material made of a resin; heating the bonding material to fuse the solder and soften the electric insulation material; solidifying the solder to form the solder bumps; and curing the electric insulation material on a surface of each of the solder bumps and a surface of the multilayer board located around each of the solder bumps to form an electric insulation surface layer.