Integrated circuit packaging system with die paddles and method of manufacture thereof

摘要

A method of manufacture of an integrated circuit packaging system includes: forming a package paddle group having a first package paddle electrically isolated from a second package paddle; attaching an integrated circuit device on the first package paddle and the second package paddle; forming a standoff terminal adjacent the package paddle group and electrically connected to the integrated circuit device; connecting a paddle connector to the integrated circuit device and the first package paddle and another paddle connector to the integrated circuit device and the second package paddle; and forming an encapsulation over the integrated circuit device, the first package paddle, the second package paddle, and the standoff terminal, the encapsulation exposing a portion of the first package paddle, the second package paddle, and the standoff terminal.

主权项

1. A method of manufacture of an integrated circuit packaging system comprising:
providing a leadframe having a top side, a gap, a first non-horizontal side, and a second non-horizontal side, the first non-horizontal side facing the second non-horizontal side and separated from the second non-horizontal side by the gap; attaching an integrated circuit device on the top side with a non-conductive adhesive, wherein the non-conductive adhesive is in the gap and directly on the first non-horizontal side and the second non-horizontal side; connecting a plurality of paddle connectors between the integrated circuit device and the top side; connecting a terminal connector between the integrated circuit device and the top side; forming an encapsulation over the integrated circuit device, the plurality of the paddle connectors, the terminal connector, and the top side; and forming the bottom side of the leadframe to form a first package paddle and a second package paddle under corners of the integrated circuit device with the plurality of the paddle connectors connected to the first package paddle and to form a standoff terminal smaller than the first package paddle with the terminal connector connected thereto.