| 摘要 |
PROBLEM TO BE SOLVED: To provide a stripping liquid for a photoresist film, which is to be used for stripping a photoresist film that has been exposed to an etchant for a Cu film and degenerated to be less strippable in a process of forming a wiring line or the like by wet etching of a Cu film or a Cu alloy film on a substrate having a large area, while avoiding damages on the Cu film, and which does not decrease an adhesive force between the Cu film and a layer to be deposited on the Cu film.SOLUTION: The stripping liquid for a photoresist comprises 40 to 60 mass% of water, 1 to 15 mass% of a tertiary alkanolamine, and 25 to 59 mass% of a polar solvent; or more than 60 mass% to 80 mass% of water, 1 to 8 mass% of a tertiary alkanolamine, and 12 to 39 mass% of a polar solvent. |
