| 摘要 |
PROBLEM TO BE SOLVED: To dissipate heat through a single member while suppressing heat transfer between a plurality of electronic components.SOLUTION: A heat dissipation component 10 for absorbing heat generated from a plurality of electronic components to dissipate heat of the electronic components includes: heat absorption parts 10a, 10b for absorbing heat from the electronic components; and a heat dissipation part 10c for dissipating heat absorbed by the heat absorption parts 10a, 10b. The heat absorption parts 10a, 10b are provided in a plural number corresponding to the number of the electronic components, and the heat dissipation part 10c is thermally connected to each of the heat absorption parts 10a, 10b. |
