MULTILAYER PRINTED WIRING BOARD MANUFACTURING METHOD AND ADHESIVE SHEET

摘要

PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board manufacturing method which can connect electric conduction parts of opposed substrates so as to improve both of mechanical adhesive strength and electrical connectivity; and provide an adhesive sheet used for the manufacturing method.SOLUTION: In a multilayer printed wiring board manufacturing method having a process of bonding electric conduction parts of opposed substrates by lamination while electrically connecting the electrical conduction parts by an adhesive sheet, the adhesive sheet includes a conductive adhesive layer having conductivity in a thickness direction, and the conductive adhesive layer has a conductive part manufactured by a conductive paste for electrically connecting the electric conduction parts of the opposed substrates and an adhesive layer filled around the electrical conduction parts. A cross-sectional shape of the electrical conduction part may be trapezoidal.