| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent or suppress increase of FPC manufacturing steps while improving heat dissipation (cooling) efficiency of an electronic component to be mounted.SOLUTION: A method for manufacturing an FPC 1 includes the steps of: laminating an adhesive layer 12 on one surface of a base film 11; sticking a conductor foil 130 on a surface of an insulation film 112 of the base film 11 by the adhesive layer 12; forming an opening 101 for conduction and heat transfer, which penetrates in series through the conductor foil 130, the adhesive layer 12 and the insulation film 112; filling a conductive paste 102 in the opening 101 for conduction and heat transfer; forming a first conductor pattern 13 electrically conducted to a metal sheet 111 from the conductor foil 130 by the conductive paste 102; and forming a second conductor pattern 113 electrically independent from other parts in a part electrically conducted to the first conductor pattern 13 in the metal sheet 11.</p> |
