| 摘要 |
PROBLEM TO BE SOLVED: To provide a module capable of efficiently releasing heat of a heating component to a motherboard when the module is accommodated within a housing and disposed proximately to one wall surface of the housing while being packaged on the motherboard.SOLUTION: A second resin layer 15 formed from a resin material of which the heat conductivity is lower than that of a resin material of a first resin layer 14 is disposed more approximately to one wall surface 2a of a housing 2 than the first resin layer 14. Therefore, when a module 10 is accommodated within the housing 2 and disposed proximately to the one wall surface 2a of the housing 2 while being packaged on a motherboard 3, heat of a heating member such as an IC 2 is transferred in a direction away from the one wall surface 2a of the housing 2 within the module 10. Thus, heat of the heating component can be prevented from being radiated from the module 10 closer to the one wall surface 2a of the housing 2, and heat of the heating component can be efficiently released to the motherboard 3. |
