| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat radiation structure capable of radiating heat without requiring a heat radiation element such as a Peltier element, while securing insulation between a heating member such as a heater element and the outside.SOLUTION: A conductor layer 14 is disposed at a lower side of an electronic component 20 that becomes a heater element, and the conductor layer 14 extends in a plane direction of a substrate 10. A heat radiation member 40 is disposed at a position opposing the conductor layer 14 with an insulation material portion of the substrate 10 interposed therebetween. In such a configuration, heat generated in the electronic component 20 is transferred to the conductor layer 14, conducted in the plane direction of the substrate 10 via the conductor layer 14, transferred to the heat radiation member 40 and discharged from a top face of the heat radiation member 40 exposed from a mold resin 50 to the outside. Thus, heat radiation is satisfactorily performed even without requiring a heat radiation element such as a Peltier element. Further, since the insulation material portion of the substrate 10 is present between the conductor layer 14 and the heat radiation member 40, the electronic component 20 can be surely insulated from the outside by the insulation material portion. |
