| 摘要 |
<p>PROBLEM TO BE SOLVED: To solve such a problem that it is required to ensure a large region for applying heat when mounting, on the side of a component opposite from the mounting surface, when mounting a component, e.g., an imaging chip, on a mounting board.SOLUTION: An imaging unit includes an imaging chip, a mounting board on which the imaging chip is mounted, a connection member for connecting the imaging chip and the mounting board electrically, and a surrounding member mounted on the mounting board and surrounding the imaging chip. The mounting board has a conductor pattern which is electrified when mounting a mounting component, i.e., at least one component out of the imaging chip, the surrounding member and the connection member, and generates heat for mounting the mounting component on the mounting board.</p> |
