| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a multilayer wiring board in which interlayer stress can be suppressed between vertically adjoining resin insulation layers.SOLUTION: A multilayer wiring board 1 includes a ceramic substrate 10, a plurality of resin insulation layers 2 laminated on the ceramic substrate 10, a thin film conductor layer 3 provided between the plurality of resin insulation layers 2 and having a tensile elasticity and a coefficient of thermal expansion larger than those of the resin insulation layer 2, and a via conductor 4 penetrating the resin insulation layers 2 in the thickness direction and electrically connecting the thin film conductor layers 3 located vertically. An insulation layer 5 is provided in close proximity to the thin film conductor layer 3 on the resin insulation layer 2, and the insulation layer 5 has a tensile elasticity larger than that of the resin insulation layer 2, and a coefficient of thermal expansion smaller than that of the resin insulation layer 2.</p> |
