| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor-manufacturing apparatus capable of more improving homogeneous heating of a wafer and suppressing temperature drop of the wafer.SOLUTION: A semiconductor-manufacturing apparatus 100 comprises: a soaking member 20 including at least a first region 20A, a second region 20B and a third region 20C. The first region 20A, the second region 20B and the third region 20C are separated by concentric circles having a reference at the center of the soaking member 20. In the first region 20A, a ratio occupied by first through holes 21A is 35% to 55%. In the second region 20B, a ratio occupied by second through holes 21B is 80% or more.</p> |
