INSULATING FILM FOR PRINTED CIRCUIT BOARD AND PRODUCTS HAVING THE SAME

摘要

The present invention provides an insulation film for a printed circuit board, RCC, FCCL, and a printed circuit board using the same. Specifically, according to the present invention, an insulation film for a printed circuit board has an insulation layer and a primer layer which is formed on one side of the insulation layer, and includes a benzocyclobutene-based resin (BCB-based resin). Accordingly, the RCC, the FCC, and the printed circuit board, which are manufactured by using the insulation film for the printed circuit board, have the low coefficient of thermal expansion and high splitting resistance.