| 摘要 |
PROBLEM TO BE SOLVED: To provide a copper foil with a carrier in which before a lamination step to an insulation substrate, the adhesion force between a carrier and an extra thin copper layer is high, and while after the lamination step, the carrier and the extra thin copper layer can be easily peeled at the interface between the carrier and the extra thin copper layer and generation of a pinhole on an extra thin copper layer side surface is favorably suppressed.SOLUTION: There is provided a copper foil with a carrier which comprises a carrier, an intermediate layer and an extra thin copper layer, where the intermediate layer is constituted of a tungsten-nickel alloy or a tungsten-cobalt alloy or a tungsten-iron alloy, the adhesion amount of tungsten of the intermediate layer is 50 to 10000 μg/dm, the adhesion amount of nickel is 50 to 40000 μg/dmwhen nickel is contained in the intermediate layer, the adhesion amount of cobalt is 50 to 10000 μg/dmwhen cobalt is contained in the intermediate layer, the adhesion amount of iron is 50 to 10000 μg/dmwhen iron is contained in the intermediate layer and the maximum of the tungsten concentration is 1 to 70 mass%. |
