ELECTROCHEMICAL ANALYSIS METHOD FOR IN-SITU FINGERPRINTING FOR ELECTROCHEMICAL DEPOSITION AND/OR ELECTROCHEMICAL ETCHING

摘要

PROBLEM TO BE SOLVED: To provide a method for monitoring and controlling the quality of electrochemical deposition and/or plating processes including a bath composition, a process chamber, and/or a film formation process on a substrate.SOLUTION: The method uses a fingerprinting analysis method of an output signal in an electrochemical deposition and/or a plating process in order to obtain an indicator indicating whether a chemical material and/or the process is operating in a normally expected range or not. The method utilizes one or more substrates as one or more working electrodes 11 and a) analyzes potentials between the one or more working electrodes 11 and one or more reference electrodes 13 to provide an output signal fingerprint represented as potential difference as a function of time or b) provides the input power of a process power supply 14 which provides input energy in a form of current and/or potential between the one or more working electrodes 11 and one or more counter-electrodes 12. The method utilizes the potential between the one or more working electrodes 11 and at least one of the one or more reference electrodes 13 and the one or more counter-electrodes 12 to provide an output signal fingerprint.