| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a chip resistor capable of enhancing adhesion strength of a resin sealant for a circuit board, and to provide a mounting structure therefor.SOLUTION: A chip resistor 1 has an inclined surface 2a formed between both side faces of a ceramic substrate 2 in the transverse direction and the back surface thereof, and satisfies following relationship; 1/3<H/T<2/3, where T is the thickness of the ceramic substrate 2, and H is the height of the inclined surface 2a. The chip resistor 1 is mounted on a land 31 provided on a circuit board 30 while directing the back electrode 3 downward, and surface mounted by joining the external electrode 8 of the outermost layer covering an end face electrode 6 with solder 32. Circumference of the chip resistor 1 is entirely sealed with a resin sealant 40, and protected against environment of light, heat, humidity, and the like.</p> |
