| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor module having a configuration suitable for downsizing.SOLUTION: A housing 10 includes an opening in the upper part thereof. Lead-out terminals 21 and 22 in the housing 10 extend toward the upper part of the housing 10. A lid 31 is provided in the opening of the housing 10. A bus bar 65 is provided in the inner side of the housing than an upper surface of the lid 31, and extends to the outside of the housing in a direction crossing an extension direction of the lead-out terminal 22. The lead-out terminal 21 is led out to the upper surface of the housing 10 through the lid 31. The bus bar 65 is provided so as to come into contact with the lead-out terminal 22 when the lid 31 is mounted on the housing 10. |
