| 摘要 |
<p>PROBLEM TO BE SOLVED: To reduce the risk that bubbles may remain in a resin when sealing a semiconductor chip or a beam lead by using a resin, compared with prior art, in a semiconductor device where a semiconductor chip provided on a substrate and a wiring pattern provided on the substrate are interconnected by means of a beam lead.SOLUTION: In a semiconductor device 1, the thickness direction of a first planar connection part 13 of a beam lead 7 connected with a semiconductor chip 5 is substantially vertical direction, the thickness direction of a second planar connection part 15 of the beam lead 7 connected with a wiring pattern 11 is substantially vertical direction, and the thickness direction of other planar part 17 of the beam lead is substantially orthogonal to the vertical direction.</p> |
