发明名称 PLATING APPARATUS
摘要 <p>PROBLEM TO BE SOLVED: To provide a plating apparatus for conductive particles with a plating container undergoing rotation and revolution which allows electric conduction between a power source and an electrode without rotation sliding of an electric contact.SOLUTION: In a plating apparatus for conductive particles, a plating container which rotates about a first axial line A revolves around a second axial line B in parallel with the first axial line. The revolution orbit of the plating container forms an intersection space including the second axial line, and an anode and a cathode are arranged in the intersection space.</p>
申请公布号 JP2015010245(A) 申请公布日期 2015.01.19
申请号 JP20130134669 申请日期 2013.06.27
申请人 HITACHI METALS LTD 发明人 ITO MOTOMICHI
分类号 C25D17/22;H01B13/00 主分类号 C25D17/22
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