IMPROVEMENT METHOD OF THERMAL RADIATION FOR LED AND PCB JUNCTION AREA

摘要

The present invention relates to a method of improving thermal radiation for an LED (Light Emitting Diode) and a PCB (Printed Circuit Board) junction area. More particularly, the present invention relates to a method of improving thermal radiation in a junction area by forming surface roughness in the junction are of the PCB or the lower part of the LED package and arranging the inner fillers of polymer bonding agent to effectively transfer heat.