发明名称 VACUUM CHAMBER WITH PURGE APPARATUS OF HIGH TEMPERATURE AND HIGH PRESSURE INJECTION TYPE AND CLEANING METHOD USING IT
摘要 <p>The present invention relates to a vacuum chamber with a purge apparatus of high temperature and high pressure injection type and a cleaning method using the same. More particularly, a purge gas for cleaning the inside of a double chamber having a single chamber and a sub chamber is supplied. A high temperature gas and a low temperature gas are alternately supplied, thereby facilitating the separation of a chamber from a foreign material attached to the chamber due to the difference of thermal expansion and condensation of the foreign material by temperature. A separated foreign material is floated by a purge gas injected with a high pressure so that the foreign material is discharged. A period of separating and cleaning a vacuum chamber after the foreign material is removed in the vacuum chamber by high pressure wind and the separation of the foreign material using the thermal expansion and condensation of different materials like this can be expanded. Equipment operating time is increased by the extension of the separation cleaning period so that productivity is improved.</p>
申请公布号 KR20150006587(A) 申请公布日期 2015.01.19
申请号 KR20130080138 申请日期 2013.07.09
申请人 SK TECHNOLOGY CO., LTD. 发明人 YUN, WON HEE;KANG, BYEUNG CHEUL;KIM, GYOUNG HUN
分类号 H01L21/02 主分类号 H01L21/02
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