| 摘要 |
PROBLEM TO BE SOLVED: To reliably fix a substrate 10 and a case 60 in an electronic device S1.SOLUTION: The electronic device S1 includes: the substrate 10 on which electronic components 20 and 30 are mounted; a heat sink 50 which is fixed to the substrate 10 and dissipates heat generated from the electronic components 20 and 30; and the case 60 which houses the substrate 10, the electronic components 20 and 30, and the heat sink 50 and includes a housing part 63 having an opening, and a lid 66 for closing the opening. The electronic device S1 also includes a heat dissipation gel 70 arranged between the lid 66 and the heat sink 50 and formed so as to surround a region A on the side of a through hole 67 between the lid 66 and the heat sink 50. In a state where an adhesive made to flow into the region on the side of the through hole 67 through the through hole 67 is stopped by the heat dissipation gel 70, the adhesive fixes the lid 66 and the heat sink 50. |
