METHOD FOR RESIN-ENCAPSULATING ELECTRONIC COMPONENT AND MOLDING DIE

摘要

PURPOSE:To prevent cracks in the vicinity of the ring-shaped groove of a plunger and breakage from the vicinity of the groove due to the cured resin in the ring-shaped groove at the time of resin-encapsulating an electronic component using the plunger provided with the ring-shaped groove. CONSTITUTION:The height H of a resin pressurizing part 9 provided between the leading edge face of a plunger 40 and a ring-shaped groove 5a on the side of the plunger leading edge is set to exceed the depth L of a cull 8 in resin path (H>L). Thus, when pressure is applied to the resin material in a pot 3 by the plunger 40, the ring-shaped groove 5a on the leading edge side of the plunger 40 is constituted so as not to communicate with the cull 8 and the molten resin material is prevented from entering the ring-shaped groove 5a.