METHOD FOR CUTTING MOLD GATE OF RESIN-ENCAPSULATED SEMICONDUCTOR CHIP

摘要

PURPOSE:To reduce notch defects and crack defects of mold due to the stress concentration on the mold by using a method for cutting the mold gate of a semiconductor chip. CONSTITUTION:Tapers 101a and 102a are provided at the leading edges of a flow cavity cut punch 101 and a through gate cut punch 102 to be used for cutting the mold gate of a semiconductor chip. The cross-section of the gate may be a circular arc convex, a trapezoid and a circular arc concave. Thus, the stress concentration on the mold at the time of cutting the gate is reduced and notch defects and crack defects are reduced.