发明名称 THERMAL MANAGEMENT OF A COMMUNICATION TRANSCEIVER IN AN ELECTRICAL COMMUNICATION DEVICE.
摘要 <p>Disclosed herein are various systems and methods relating to communication devices that include modular transceivers, such as small form pluggable transceivers. According to one embodiment, a communication device may include a chassis defining an interior and an exterior of the communication device. The chassis includes a top, a bottom, and a plurality of sides that together with the top and the bottom form an enclosure. One of the sides may include a first segment disposed in a first plane and a second segment disposed in a second plane. The second segment includes an outwardly extending communication transceiver housing configured to receive a communication transceiver. The communication transceiver may extend through an aperture in the second segment and into interior of the communication device to contact an electrical connector, while a second portion of the communication transceiver in the communication transceiver housing remains on the exterior of the communication device.</p>
申请公布号 MX2014013156(A) 申请公布日期 2015.01.19
申请号 MX20140013156 申请日期 2013.05.28
申请人 SCHWEITZER ENGINEERING LABORATORIES, INC. 发明人 DENNIS GAMMEL;MARK A. THOMAS;SHANKAR V. ACHANTA
分类号 H05K7/20 主分类号 H05K7/20
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